Advanced Cooling Technologies, Inc. 15A in 1A steps, 12V_VS1 0A. Thermal barrier coatings (TBCs) are a multilayer coating of a combination of low thermal conductivity, high melting-point ceramics and alloy materials. Description. VITA Stabilized Maintenance Description. 2. Power and reset LEDs are provided for. The mechanical design of VITA 48. 1 6U part # description VME-HF-3U 3U VME Heat Frame Blank Assembly Kit VME-HF-6U 6U VME Heat Frame Blank Assembly Kit CPCI-HF-3U 3U. C: -40 Operating Temp. 8 does not use module-to-chassis conduction cooling, it also promises to help drive innovative use of new lightweight polymer or composite material-based chassis. It is conduction-cooled through the card edge/wedgelock. Heat is carried away by the blocks, which consist of the top cover, bottom cover, and wedge Description. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction CooledWatch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. Open VPX is the architecture framework that defines system level VPX interoperability for. Aitech’s C164 is a high-performance 6U VME SBC for embedded and harsh environment applications. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Because VITA 48. PICMG 2. VPX systems are typically built with an air or conduction cooled chassis which holds the VPX backplane and provides the mechanical support for the VPX plug-in modules. This design and development were by MSS, including all the Windows-based software and qualification to full DO-160. The power supply options range from a 400W ATX for low end applications to a 1200W modular supply for high end power requirements. Abaco Systems' range of development chassis allow system integrators to evaluate products in a laboratory environment, secure in the knowledge that the same cards can be ordered in different ruggedization levels to meet the demands of many deployed environments, from benign air cooled, to fully rugged conduction cooled. Over the last 20 or 30 years, as conduction cooling became established as the approach for the majority of the hottest VME- and. The PSC-6236 offers current sharing with up to four power supplies in a system for outputs of 12V, 5V and 3. cPCI 3U 8 slot development system. 8” slot. Dawn created the “CUBE” family of enclosures to address the needs of the UAV market. RuSH controlled power and cooling supports high current demands and corresponding. The up to 800 Watt power output true 6-channel supply provides full Open VPX support and is current/load share compatible with up to 4 PSC-6238 units. The XPand1203 is a low-cost, flexible, development platform. 2-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. The aim is to ensure mechanical interchangeability of conduction-cooled circuit card assemblies in a format suitable for military and rugged applications and to ensure their compatibility with both conduction cooled chassis and commercial, air-cooled, single height (3U) and double-height (6U) x 160mm, Euroboard chassis. 0 CompactPCI standard, which uses the parallel PCI bus for communication among a system’s card components. Subrack based, sheet metal, desktop or tower configurations. 64PS1 - North Atlantic Industries. downloads. The P0CC1 6U PMC Carrier is a single slot replacement unit supporting two single or one double width PMC which can beForm Factor: 6U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 17. CompactPCI Serial Chassis. An open-frame solution for the open-minded engineer. or 1. (H) Four 0. The WILDSTAR 3XV7 integrates Xilinx's new Versal™ Premium VP1502 or VP1702 FPGA. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system. Conduction cooled card guide for Dawn DC-(n) Series air cooled development chassis. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. 5 Air & Conduction-Cooled Ruggedization Levels Standard Features – 1 Megabyte (MB) L2 Cache with private L2 Bus (2 MB for 7410). VMEbus System, 7 U, 12 Slot, Open Frame PSU. 3V/25A, 5V/20A, 12V_AUX/1. Conduction cooling methods move heat from the source to a cooler area over a short distance; the heat can then be removed by liquid- or forced-air cooling. 3/4 ATR, conduction-convection cooled. Systems Integrators can plug the VME-680 into their VME64x chassis and focus on architecting their network through one of may intuitive management interfaces (Table 3) and (Figure 5). Find VME Chassis related suppliers, manufacturers, products and specifications on GlobalSpec - a trusted source of VME Chassis information. 6-Slots of 3U VPX with integral 6-channel intelligent 400W power supply. 0 in. Advanced airflow design distributes air across external fins in sidewalls. A&A Performance Chassis : 3352 Compton Rd. ACT developed an integrated design and delivered turnkey parts that were developed to be highly ruggedize and provided thermal conductivity > 750 W/m-K. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. 100G Ethernet Data plane. The XPand1201 is a low-cost, flexible, development platform. 8 in. Higher conduction means lower component temperatures . are not included with this equipment unless listed in the above stock item description. Downloads. The Open Frame Chassis have built in manual controlled 120mm front fans and monitoring for fan and voltages. VXS uses a straightforwardFPGA-Based VME Bridge; IPMI for VPX Systems; Cisco IOS-XE® Embedded Services Routing; Built-In Test (BIT) coreboot & FSP for Intel; Green Hills INTEGRITY. Status LED indicators allow users to verify proper Operating Temperature: -4 to 122 F; Type: Rack. These PSUs are available in 3U or 6U form factor. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications. Enclosures that accommodate up to twelve 3U and 6U VME, CompactPCI and VPX conduction-cooled boards. Elma's new liquid cooled chassis is available with a 6U OpenVPX backplane on a 1" pitch per VITA 65 Backplane Profile BKP6. OpenVPX 6U 8-slot ATR Chassis; OpenVPX 6U 10-slot Air Over Conduction 1200 Watts / Drive Bay; ATR-3500 6-slot MicroTCA with cPCI and VPX Backplane options; ATR-5700 6-slot 3U VPX Air Cooled; RGE-9313; RGE-9613; RGE-9813; RGE-9853;Dawn VME 11-1015501 7-Slot VMEbus Chassis. Operating Temperature > 8 slots: 0°C. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. The convection bridge is clamped between the VME. Conduction-cooled PMCs, PPC4A offers expansion with a family of standard PMC Carrier Cards. Rugged rackmount solutions in various formats. Environment: Extended Temperature, Extended shock & vibration : Height: 10. 97"H Chassis Cooling: Conduction-Cooled, Natural Convection-Cooled. The C6100 can be installed into any IEEE 1101. The VME195-x mini crate is the perfect choice for small setups with only a few VME64x modules. Mechanical characteristics of conduction-cooled versions of Eurocard-based circuit card assemblies are described. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 4″L x 6″W x 7. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. 1 PICMG 2. • (3) Ethernet Ports. VME VME P2 Figure 3: PPCM1 I/O Diagram Ruggedization Levels PPCM1 is available in Radstone’s 5 environmental ruggedization levels (see Table 1). Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 3V, 5V, +12V_Aux, -12V_Aux & 3. 1 PICMG 2. 3U CompactPCI. The stronger the need for computer power, the more. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. The card slots within a chassis hold the heat frames that PCB boards attach to. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. As system density has increased, the need for more aggressive and innovative thermal management techniques are needed. A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. 3V_AUX/6A (from VS2) Power Supply Type: VPX / 600W, VPX power supply Ruggedized, air cooled. card assemblies in a format suitable for military and rugged applications and to ensure their compatibility with both conduction cooled chassis and commercial, air-cooled, single height (3U) and. LONDON--(BUSINESS WIRE)-- nVent Electric plc (NYSE:NVT) (“nVent”), a global leader in electrical connection and protection solutions, today launched a new High Thermal Integrated Conduction Cooled Assembly for the aerospace and defense industries. PXI /. With the VPX3-663, designers can create switched networks that allow any module in the system to connect to any. From. VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. 0 specification for use in. 103-7620-001_E. These are used mainly in military and aerospace applications where convection cooling cannot be used. Chassis Platforms Product Type Elma Air Transport Rack (ATR) enclosures offer a standardized, cost effective solution for VME, VME64x, CompactPCI, VXS, VPX and Small Form Factor (SFF) based applications. 0 specification for use in Mil/Aero VPX systems. The standard model is conduction to wedge lock. It can withstand extreme environmental conditions such as temperature, shock, vibration. PSC-6265. Air- cooled variants are designed to be used in standard industrial VME chassis. This platform conforms to VITA 1. The Intel® Atom™ E3800 processors provide excellent computational performance and I/O functionality for their power profile and size. ATR Size : Max 6U Slots : 1/2 Short : 5 : 1/2 Long : 5 :Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. • (3) DB-9 Ports. 2. Pluggable into a 3U or 6U VPX chassis, data transfer can be over a PCIe connection up to PCIe Gen3 x 16. 8" &' 1. 62H. The XPand1303 is a low-cost, flexible, development platform. 950 inch Standard Conduction Cooled VITA Card in SOLIDWORKS. This specification is applicable to, but not limited to, the VMEbus standard, an internal interconnect (backplane) bus intended for connecting processing elements to their immediate fundamental resources. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. pdfA VME Chassis will be between 1 and 21 slots (the maximum). Different widths and combinations of 3 and 6U slots are available also. View VPX Rugged SystemsDawn’s PSC-6238 is a wedge lock conduction cooled module on a 1 inch pitch with an operating temperature of -40 0 C to +85 0 C at the wedge lock edge. ATR Chassis. The chassis comes with different sizes and are equipped with various backplane options vis-à-vis 3U/6U. Provides up to an 5-slot system for 6U convection or conduction cooled boards and 6U transition modules on 1. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 5″ (38mm). This portable chassis is well built, attractive and travels well between the bench top, the trade show, and your customers. nVent SCHROFF offers two 19" chassis platforms, MultipacPRO and Interscale, both with options for various. Systems Integration Plus, Inc. 20 based. Conduction Cooled Version of Pixus VPX Chassis Manager. PCI was the first universal, processor-independent computer bus that was adopted by all major microprocessor manufacturers. Hartmann Electronic is an industry leader in the designing, manufacturing and production of backplane technology, including VME and VME64x. A well-designed HVAC energy recovery heat pipe system will provide effective and affordable energy recovery during the hot summer and cold winter months as well as throughout the year. XCalibur1931. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 6U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. Versions in alignment with the SOSA (TM) Technical Standard. 2 (REDI) and VITA 65 (OpenVPX). Conduction Cooled Version of Pixus VPX Chassis Manager. View product. CompactPCI Serial Chassis. +85°C. A rich set of firmware and. All external interfaces are accessed through the P2 connector of the VME backplane. VME 64x 6U 166 Series. 5"L x 5. 2 standard for conduction cooled VME systems. VME64x 2U/84HP 4 Slots. The chassis is cold plate base coupled conduction cooled. The VME/PMC 64x Conduction-Cooled Carrier is a 6U VME card that supports up to two (2) PMC modules. VPX-4U-Chassis-Datasheet. Kontron's standard selection of 3U and 6U CompactPCI card cages and ready integrated system platforms. PXI / PXIe Chassis Our PXI and PXIe solutions are designed and. Modernize VME & mezzanine systems with high-performance switching & routing. Switches, bridges and clock modules (PXIe), and even cooling are modular allowing for easy customization. The Open Frame Chassis have built in manual controlled 120mm front fans and monitoring for fan and voltages. While Hartmann Electronic thrives on the development and production of high-speed backplane technology, what good would our backplanes be without a high-quality enclosure?Accommodates up to ten 6Ux160mm conduction cooled VPX cards. Since heat energy wants to move from. Conduction Cooled VMEbus Modules. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. 10A in 0. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. Card Thickness: 2. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. With PCI Express now the de facto on- and between-board “bus,” it’s more important than ever to debug signals and protocols. AccessoriesConduction cooled card guide for Dawn DC-(n) Series air cooled development chassis. Convection and Conduction cooled ATR (Air Transport Rack) enclosures offer a standardized, cost effective solution for PCI, VME, VME64x, VXS, cPCI and. This platform conforms to VITA 1. Air Cooled. Description. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. 3U Conduction Cooled VPX Extender with Fan Option. 11") Connectors: 2 mm press-fit, quality grade 2. Wire-free design. Find 6U VME Chassis related suppliers, manufacturers, products and specifications on GlobalSpec - a trusted source of 6U VME Chassis information. 2 (REDI) and VITA 65 (OpenVPX™) † 6U, 7-slot backplane, 1” pitch per VITA 65 Backplane Profile BKP6-CEN07-11. Thanks to this standard, conduction cooled boards and chassis selected Find the right VME or VME64x system for your application, available with horizontal or vertical card cages, as subrack or desktop versions, pluggable or open frame power supplies and included cooling concept: VMEbus and VME64x systems available for 6U boards. Rhino - 3U/6U Conduction Cooled. The rugged chassis holds 6U conduction-cooled boards with a 1-inch pitch per VITA 48. VME and VME64x Systems. 5A, 3. SOSA™ Aligned Technology CapabilitiesThis rugged 3U VPX air conduction-cooled chassis from Elma is for avionics, land vehicles, and other military SWaP-constrained applications. The chassis comes with different sizes and are equipped with various backplane options vis-à-vis 3U/6U. 0 specification for use in Mil/Aero VPX systems. 8” pitch versus a typical 1. 10. Backplane: Custom 6U, 10 slot open VPX Backplane (Dawn P/N 08-1017654 Rev. With moveable rear profiles (up to 2. The VPX3-663 combines a PCIe Gen 3. The power supply is plugged into rear behind the fan tray. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards. The heat frame provides the following functions: Provides rigid support and structure to the PCB board against shocks, such as the vibrations in an airplane; Interacts with the chassis and utilizes conduction cooling to cool down the PCB boardCan be provided in a range of ATR sizes. SOSA-Aligned 100GbE EcoSystem. About - 1-ACT. In addition to theseThe Conduction Cooling Experts: Advanced Thermal Management Equals Reliability With a heritage of more than 30 years, Curtiss-Wright has long been recognized as the COTS industry’s leading expert in the design of conduction cooled standards based modules. 0 Serial: 2 RS-232/422/485, 4 RS-232 FPGA: Xilinx Artix-7. Different widths and combinations of 3 and 6U slots are available also. 3 VDC output at 75 Watts. We offer a wide range of ATR chassis that are convection, conduction cooled and liquid cooled. 2 specification. 5-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. VITA46, VITA48 (VPX REDI) and VITA65 (Open VPX) ready accessories, backplanes, development chassis, power supplies, enclosures and rack mounts. Chassis is cold plate base coupled conduction cooled and rated for operation over -40 to +85°C range. VME and VME64x Systems. 1/2 ATR, conduction-convection cooled. 8 does not use module-to-chassis conduction cooling, it also promises to help drive innovative use of new lightweight polymer or composite material-based chassis. 1-1997 while providing a low profile, practical packaging solution for high-performance. VITA Conduction Cooled Assemblies, 6U260VITA48. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. 2-7. The heat from the internal conduction-cooled modules is. 62”H; 1ATR ARINC 404A Tall/Long format Weight: TBD Electrical Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. 600-Watt DC/DC Converter, 6U VME. Revolutionary design allows for up to 175 Watts per slot of conduction cooling; Precision machined from 6061 T6 Aluminum; Corrosion resistant gold alodine finish; Field installable using 4-Torx driven screws; Fits all Dawn DC-n series development chassis; Installs in place of plastic guides; Converts air cooled chassis to conduction cooled Learn more about Hartmann Electronic's card guide with a conduction cooled cold plate 50HP for Open Frame Chassis, 5HP slot pitch. Aitech Defense Systems Inc. Ideal for highly dense embedded systems with exceptional heat dissipation requirements, the new platform holds 6U conduction cooled boards with a 1" pitch per VITA 48. Conduction cooled base coupled, via short and effi cient thermal path, provides for optimum cooling. The stronger the need for computer power, the more. Designed to meet the requirements of VITA 62 for use in harsh environments. Development chassis for VPX and SOSA aligned module payloads. Elma's new liquid cooled chassis is available with a 6U OpenVPX backplane on a 1″ pitch per VITA 65 Backplane Profile BKP6-CEN07-11. With moveable rear profiles (up to 2. 0 specification for use in Mil/Aero VPX systems. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Hartmann Electronic’s 4 slot 19” rack mountable VME solution – The VME64x 2U system. VME Chassis is a Metallic box or enclosure which normally contains VME Backplane, cooling systems like fans and Power supply unit like SMPS. Started in 2003 as an R&D company, ACT has grown into a leading manufacturer of thermal management products for diverse industries and applications. 1ϕ / 3ϕ AC or 28v DC Input power supply up to 1500w. Related To: Dawn. Conduction cooled VME electronics Vibration: Card-edgetempen_re: Number of VME modules 20 0. 11 Slot SOSA Development System. High Quality Chassis and Enclosures for 3/6U VPX and OpenVPX Applications. Chassis Type: ATR Chassis Cooling: Forced Air Module Cooling: Conduction Number of Slots (1″ pitch): Various Operating Temp. Operating temperature range: -40°C to +85°C. 59"L x 4. 0 specification for use in Mil/Aero VPX systems. Trident offers a wide range of ATR chassis that are convection, conduction cooled, forced air conduction cooled and liquid cooled. This Model Can be used to design the VITA Card Chassis. Power Supplies. Elma’s line of rugged Air Transport Racks (ATRs) provide ideal cooling and reduced weight through superior. They are low-power system-on-chip (SoC. Dawn VME Products 47915 Westinghouse Drive • Fremont, CA 94539 510-657-4444 Dawn’s 3U form factor conduction cooled chassis for cold plate deployment is designed for all rugged environments: airborne, land, and sea. Description. For all rugged environments: Air, Land, and Sea. 16. All conductive plates and surfaces are typically aluminum. Universal AC Input. Terminal, 8 slots: On-board Schottky barrier diodes. Open VPX backplane with VITA 62 power slot. (ACT) is a premier thermal management solutions company, focusing on custom applications of two-phase heat transfer technology. See Details. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. 0 inch pitch. PXI /. 2 restricts air flow to the card edges where it’s cooling impact is limited and so conduction cooling and air cooling solutions are usually considered mutually exclusive. Hartmann Electronic’s slimmest 19” rack mountable VME solution – The VME64x 1U system. PXI /. View Orion's Single Board Computers here. PSU, open frame, 444 W (400 W at < 180 VAC) Backplane VME 8 slot, 6 U, J1/J2 monolithic in accordance with VITA 1-1994. 0 CompactPCI standard, which uses the parallel PCI bus for communication among a. In addition to rugged enclosures, we also offer a range of development platforms for the latest technologies such as OpenVPX. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. Type 12R2, 9U, 19" Rackmount, MIL-Rugged, Vertical Chassis. VME-6U-COOL has 12 positions for fans to be mounted. Pixus has a wide variety of modular 19" rackmount, desktop, and ATR enclosure platforms for CompactPCI Serial systems, allowing virtually limitless configurations. 08 of Vita65. High Quality Chassis and Enclosures for High Speed CompactPCI Serial Applications (up to PCIe Gen. PXI Express Chassis. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. Why We Are the Leaders in COTS FPGA-Based High Performance Computing. It is conduction-cooled through the card edge/wedgelock. The chassis interface 400 comprises convection bridge heat exchanger 402, standard 6U VME electronics module 404, a heat flow 406, an air flow 408, a card slot pitch height 410, generic 6U VME backplane 420, generic 6U VME connectors 412, a modified chassis side panel 414, a wedgelock clamp 416, and non-conduction-cooled standard. For a chassis with sealed side walls and lid. As VXS is based on a 0. These rugged enclo-sures are available to support either one-inch or 0. Ability to work with existing board, frame, or chassis designs. CP949 is a 7-port Ethernet switch in a conduction cooled, single-slot 6U CPCI form factor. Input Voltages: 19-35 VDC. And with now-available high I/O VPX boards, there will be more PCIe lanes than ever traveling around a VME chassis; that’s why it’s critical to make sure those PCIe lanes. 3-n. 0 specification for use in. 5-slot, 6U OpenVPX (VITA 65) backplane, 1-in pitch. Up to 128 Gbytes DDR4 memory for server grade applications. CompactPCI Serial Chassis. Conduction-cooled VME cards use wedge locks instead of the normal injector/ejector, and they do not have a front panel like traditional convection-cooled VME cards. The card slots within a chassis hold the heat frames that PCB boards attach to. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. 3U/6U Short/Short, Short/Long, Tall/Short, Tall/Long & Dwarf to 1 ½ ATR Chassis. 8 (. 700 W VITA62 PSU | conduction cooled | 6 U | 5 HP | DC. MIL-STD-704F compliant except 50mSec holdup provided by separate module. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Compared to conventional wedgelocks, the ICE-Lok® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. This platform supports up to eight 0. ATR Chassis. 20 based. 0 in. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. Liquid Cooled ATR Enclosure. SOSA™ Aligned Technology Capabilities Rugged Chassis for Mobile Military/Aerospace Applications Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses; Environmentally Sealed; Compact and Lightweight with 5 Standard VME64x Slots; Internally Conduction-Cooled; Externally Cold Plate Cooled; Fully Sealed Faraday Cage and Complete EMI/RFI Power Line Filtering Cooling: Air flows around a finned, conduction cooled internal, sealed chassis and exits rear of chassis pulled by a single exhaust Tubeaxial high air flow 28V exhaust fan (can be powered with internal AC supplies) – less expensive option desired Liquid cooling, typically at the base, relying on conduction from chassis; Air cooling, using fins directly attached to the chassis sidewalls; HIK™ CARD FRAMES SOLVE THERMAL MANAGEMENT CHALLENGES. The backplane provides seven slots, each cooled up to 100 W; one slot for storage, one for switch and five payload slots. 8 in. 6-slot, 3U OpenVPX (VITA 65) backplane, 1-in pitch. Compliant with VITA 65 Specification. PSC-6238. 600-Watt DC/DC Converter, 6U VME. A network-attached Flyable Data Loader (FDL). The modular power supply can be configured with AC or DC filtered inputs. 0 specification. Optionally the customer can have conduction cooling arrangement for single slots or for the complete chassis. Factory programmable power sequencing of all voltage rails. Thermal design, simulation and analysis services. The ATR-5700 uses a microcomputer controlled 600W 6-Channel, VPX power supply that operates at 94% efficiency. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Get more information on our VME Processors, such as the 6U VME7555 and VME7653 from Orion Technologies on. Achieving highest efficiency of the power converters the VITA and. The liquid-cooled chassis sidewalls will support electronic modules each dissipating in excess of 150 watts. Meets ARINC 404A and ANSI/VITA 48. 6″ form factor. sets itself apart from other rugged electronic packaging suppliers by specializing in engineered packaging solutions, primarily for military, heavy industrial and aerospace applications. EMI/RFI Power Line Filtering. I designed this 3U VPX 0. 3U 2 Slot OpenVPX Development Chassis. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. Show More Description. B). The VPX enclosures come in 1U-4U horizontal-mount (for 3U boards, 6U boards, or a mix), 4U-6U vertical-mount (for 3U cards), and 7U, 9U, and higher chassis (for 6U OpenVPX boards). Trident’s rugged small form factor (SFF) commercially off the shelf (COTS) embedded computer is designed for harsh environments of military, aerospace and heavy industries and addresses the challenging need for many space constrained applications in avionics, aerospace and defense industries. 2. ATR, rugged, air- and conduction-cooled, Integrated Systems} kontron {VME Rugged-Standard-3 to 18 slot} MacroLink Inc. 8” slot. 2) modules. Load sharing circuitry for up to 4 modules. This GE Fanuc / Radstone PPC2EP-603-5CG VME Conduction Cooled Single Board Computer is new from surplus stock. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. 5A, -12V_AUX/1. Radstone or third-party ATR style enclosures. 2, VITA 30. Rugged Convection- & Conduction-Cooled Boards & Systems. Conduction cooled base coupled, via short and efficient path, provides for optimum cooling. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. 8 in. W-IE-NE-R is providing a line of conduction cooled VITA 62 compliant modular plug-in power supplies for VPX applications. +70°C, ≤ 8 slots: -40°C. Any kind of project specific variations can be provided on request. When faced with limited space and challenging cooling conditions, count on SCN to provide a rugged Aitech enclosures in many sizes and footprints. Input Transients as per MIL-STD-704E / MIL-STD-1275D. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. A user's guide to the VME, VME64 and VME64x bus specifications - features over 70 product photos and over 160 circuit diagrams, tables and graphs. (W) x 5. Over the evolution of its near 40 years of existence,. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. 19" Chassis.